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焊锡是指通过熔化焊料让其流动到接合处，使两种或两种以上的金属接合起来的过程，焊锡会随着温度的降低而凝固成接点.
2006年7月，RoHS规则被引进到欧洲，此规则要求无铅焊锡，这已成为业内的一个无铅产品被要求必须与常规设备和生产过程一致，与熔点，浸润性，成本， 稳定的供给有关的补救问题也同样被要求.
焊锡最常见的用途是被用来将电子零件组装到印刷电路板上.
| Pb-Free Cored Solder Wire Lineup |
| Series |
Flux Name |
Alloy Name |
Alloy Composition |
Point of Fusion |
Characteristics |
ApplicationExample |
| Solidus |
Liquidus |
| KR-19 |
KR-19 |
LFM-48 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
○ Excellent workability. Suitable for solder-resistant materials such as Ni, SUS and exidized components.
○ Easy to work to large components. |
General components, Ni SUS, Cu wire, Terminal, Case soldering. |
| LFM-22 |
Sn-0.7Cu |
227 |
227 |
| RMA |
KR-19SHRMA |
LFM-48 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
○Possible to use as non-cleaning.
○Good sustainability of activity, great for drawing solder and fine pitch work. (Measure for bridge and projection)
○Solder ball and scattering are veryfew. |
Component which has many pins, such as QFP, connector.
Substrate repair, LCD soldering. |
| LFM-22 |
Sn-0.7Cu |
227 |
227 |
| HR-19M |
HR-19M |
LFM-48 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
○High reliability flux used.
○Suitable for the point soldering. Few solder balls. |
Single-sided substrate.
General substrate, such as through-hole substrate. |
| LFM-22 |
Sn-0.7Cu |
227 |
227 |
| SR-34 |
SR-34 |
LFM-48 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
○Excellent workability. Excellent wettability at the intial stage.
○Good sustainability of activity, easy to work because of good separate-abililty.
○Excellent workability. Still better wettability than SR-34 at the initial stage.
○Few solder balls. |
Single-sided substrate. General substrate, such as through-hole substrate.
Single-sided substrate. General substrate, such as through-hole substrate. |
| SR-34 SUPER |
| SR-34 |
LFM-41 |
Sn-0.3Ag-2.0Cu |
217 |
270 |
○For Cu thin line only. Prevent Cu leaching. |
Micro speaker. Moter.
Micro moter. |
| GUMMIX |
GUMMIX-19 |
LFM-48 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
○No peel-off of flux residue. No solder ball. No scattering.
○Softening temp. offlux residue is high, so possible to use under the high temp. atmosphere. |
PickUp,relay, SW.
As antiscattering solder. |
| GUMMIX-19CH |
○No peel-off of flux residue. No solder ball. No scattering.
○Wettability improved product of GUMMIX. |
PickUp,relay, SW.
As antiscattering solder. |
●Feel free to ask for our salesman about other alloy composition.
●Standard flux content is 3.5%. (4.5% is possible in some products)
●Standard wire sizes are 0.5, 0.65, 0.8, 1.0, 1.2, 1.6, 2.0 (mm). |
| Pb-Free Solder Paste Lineup |
Series |
Alloy Name |
Particle Size |
Flux Name |
Point of Fusion |
Characteristics |
ApplicationExample |
| Solidus |
Liquidus |
| Sn-Ag-Cu |
LFM-48 |
X
W |
TM-TS |
217 |
220 |
○Excellent wetting-up. Good wettability and less solder
ball at the high temp. preheat.
○Few void. Excellent self-alignment effect. Shelf life is 6 months. |
General Pb-Free solder paste.
Recommended peak temp. is upper 230°C |
| LFM-14 |
217 |
218 |
| Sn-Ag-Cu |
LFM-48 |
X
W |
TM |
217 |
220 |
○Excellent spreadability. Long life. Good self-alignment effect.
○Shelf life is 6months. |
General Pb-Free solder paste.
Recommended peak temp. is upper 230°C |
| LFM-14 |
217 |
218 |
| Sn-Ag-Cu |
LFM-48
LFM-14 |
X
W
U |
TM-HP |
217
217 |
220
218 |
○Soldering is stabilized at the high temp. preheat.
○No crack of fluxresidue. |
General Pb-Free solder paste.
Recommended peak temp. is upper 230°C.
Possible to use at the high temp. preheat. |
Sn-Zn-Bi |
LFM-31 |
X
W |
MHS32 |
190 |
199 |
○Clear the problems of products life at the storage and use. Can use at high temp. preheat.
○High reliability (RMA type) and excellent wettability. |
Low melting point solder paste.
Possible to reflow at 210-230°C peak temp. |
Sn-Ag-Bi-In |
LFM-70 |
X
W |
INP |
197 |
203 |
○Clear the problems of products life under the high humidity atomosphere (printing, mounting)
○Few tombstone, excellent wettability at the lead wire tip. |
Low melting point solder paste.
Possible to reflow at 210-230°C peak temp. |
Sn-Bi |
LFM-65 |
X
W |
A75 |
139 |
139 |
○Few micro-solder ball which is a problem of Sn-Bi series. |
Special low melting point solder paste.
Camera module. |
●Feel free to ask for our salesman about other alloy composition.
●500g jar is the standard. We also have syringe containers.
●Particle size : X=25-45µ, W=20-38µ, U=10-25µ. |
| Pb-Free Bar / Solid Solder Wire Lineup |
|
Alloy Name |
Shape |
Alloy Composition |
Point of Fusion |
Characteristics |
ApplicationExample |
| Solidus |
Liquidus |
Bar/
Solder Wire |
LFM-22H |
Bar
Solid wire |
Sn-0.7Cu-α-β |
227 |
227 |
○For general dipping, flow. Eutectic of SnCu solder alloy.
○Great antioxidant effect. |
Single-sided substrate. For dipping. |
LFM-48K |
Bar
Solid wire |
Sn-3.0Ag-0.5Cu-α |
217 |
220 |
○SnAgCu alloy JE ITA recommended. For general dipping, flow.
○Great antioxidant effect. (Use under 350°C) |
Double-sided substrate. |
LFM-59H |
Bar
Solid wire |
Sn-3.0Cu-α-β |
227 |
312 |
○For Cu thin wire. Anti-Cu leaching.
○Great antioxidant effect using under high temp over 350°C. |
Good for soldering up of coil wire. |
LFM-62H |
Bar
Solid wire |
Sn-3.0Cu-0.5Ni-α-β |
228 |
394 |
○Especially for Cu very thin wire.
○Great antioxidant effect using under high temp over 400°C. |
Great effect on Cu wire under 50 microns. |
●Feel free to ask for our salesman about other alloy composition.
●Standard sizes of solid wire type are 1.6, 2.0(mm).
|
| Handling Alloy Composition Lineup |
|
Alloy Name |
Alloy Composition |
Point of Fusion |
Characteristics |
| Solidus |
Liquidus |
| LFM-14 *1 |
Sn-3.5Ag-0.7Cu |
217 |
218 |
lowa Univ. Licensed alloy |
| LFM-22 |
Sn-0.7Cu |
227 |
227 |
Sn-Cu eutectic |
| LFM-27 *2 |
Sn-2.5Ag-0.5Cu-1.0Bi |
214 |
223 |
Oatey licensed alloy |
| LFM-31 |
Sn-3.0Bi-8Zn |
190 |
199 |
Zn series low melting alloy (for only solder paste) |
| LFM-34 |
Sn-3.5Ag |
221 |
221 |
Sn-Ag eutectic |
| LFM-41 |
Sn-0.3Ag-2.0Cu |
217 |
270 |
Anti Cu leaching (for only cored solder wire) |
| LFM-48 *1 |
Sn-3.0Ag-0.5Cu |
217 |
220 |
JEITA recommended alloy |
| LFM-52 |
Sn-3.5Ag-0.5Bi-3In |
190 |
214 |
In series low melting Pb-Free solder |
| LFM-57 |
Sn-5.0Sb |
235 |
240 |
High temperature Pb-Free solder |
| LFM-59 |
Sn-3.0Cu |
227 |
312 |
Anti-Cu leaching (for only bar/ solid solder wire) |
| LFM-62 |
Sn-3.0Cu-0.5Ni |
228 |
394 |
Anti-Cu leaching (for only bar/ solid solder wire) |
| LFM-65 |
Sn-58.0Bi |
139 |
139 |
Sn-Bi eutectic (for only solder paste) |
| LFM-70 |
Sn-3.5Ag-0.5Bi-8In |
197 |
203 |
In series low melting Pb-Free solder |
| LFM-71 |
Sn-3.5Ag-0.5Bi-4In |
201 |
208 |
In series low melting Pb-Free solder |
*1JP PAT. No. 3027441, US PAT. No. 5527628
*2US PAT. No. 4879096
(* Marked alloys are certified as the patent license) |
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