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  Flexible Printed Circuit (FPC)  
 

Flexible Printed Circuits (FPC) as the name suggests, is a circuit wiring material that has flexibility. Sine they are thin and lightweight, they have contributed greatly to making devices more compact, lighter and thinner. In addition, their excellent heat resistance makes mounting parts by reflow soldering (heated solder treatment) possible. Furthermore, their excellent durability in repeated bending makes them indispensable as wiring materials in the movable parts of devices. They have been used extensively to take advantage of these features, including the wiring of mobile telephones, digital cameras, moveable parts wiring of hard disk drive (HDD), optical disks and other devices.

FPC is an order made item according to the specification required by customers which include different electronics and mechanical characteristics.

The following are some general information on material selection to determine the appropriate design in your product:

  1. Insulation Materials – PET, PI, Liquid Crystal Polymer (LCP)
  2. Thickness of Materials – e.g. 25um,12.5um
  3. Copper Foil – Copper or Rolled Copper
  4. Copper Foil Thickness – 12, 18um
  5. Plating Material – Nickel/Gold/Solder
  6. Layer of Adhesive for Stiffener – TSA (Temperature sensitive adhesive), PSA (Pressure sensitive adhesive)
  7. Stiffener – FR4, SUS, PI
  8. Surface Treatment- Galvanic, Nickel, Gold, Electro Less Nickel Immersion Gold, Organic Solder Ability Preservative (OSP)

There are many other different criteria in designing the FPC, please consult our specialist to discuss further.

  
 
 
 

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